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| Nichia STS-DA1-0051 SPECIFICATIONS FOR NICHIA CHIP TYPE GREEN MODEL : NJSG107T LED NICHIA CORPORATION Nichia STS-DA1-0051 1.SPECIFICATIONS (1) Absolute Maximum Ratings Item Forward Current Pulse Forward Current Allowable Reverse Current Power Dissipation Operating Temperature Storage Temperature Dice Temperature Soldering Temperature IFP Conditions : Symbol IF IFP IR PD Topr Tstg Tj Tsld Absolute Maximum Rating 500 800 85 2.2 -40 ~ + 85 -40 ~ +100 130 Reflow Soldering : 260C and Duty < 1/10 = (Tc=25C) Unit mA mA mA W C C C for 10sec. Pulse Width < 10msec. = (2) Initial Electrical/Optical Characteristics Item Symbol Forward Voltage VF Luminous Flux v x Chromaticity Coordinate y Please refer to CIE 1931 chromaticity diagram. Condition IF=350[mA] IF=350[mA] IF=350[mA] IF=350[mA] Typ. (3.9) (65) 0.189 0.718 (Tc=25C) Max. Unit 4.4 V lm - (3) Ranking Item Forward Voltage Rank H Rank M Rank L Rank P16 Rank P15 Rank P14 Rank P13 Symbol VF Condition IF=350[mA] Min. 4.0 3.6 3.2 72.0 60.5 51.0 42.8 Luminous Flux V IF=350[mA] (Tc=25C) Max. Unit 4.4 V 4.0 3.6 85.6 72.0 lm 60.5 51.0 Forward Voltage Measurement allowance is 3%. Luminous Flux Measurement allowance is 10%. Color Ranks x y 0.14 0.64 Rank G 0.14 0.22 0.74 0.74 0.22 0.64 x y 0.21 0.65 (IF=350mA,Tc=25C) Rank H 0.21 0.28 0.28 0.73 0.73 0.65 Color Coordinates Measurement allowance is 0.01. Basically, a shipment shall consist of the LEDs of a combination of the above ranks. The percentage of each rank in the shipment shall be determined by Nichia. 2.INITIAL OPTICAL/ELECTRICAL CHARACTERISTICS Please refer to "CHARACTERISTICS" on the following pages. -1- Nichia STS-DA1-0051 3.OUTLINE DIMENSIONS AND MATERIALS Please refer to "OUTLINE DIMENSIONS" on the following page. : Ceramics Material as follows ; Package Encapsulating Resin : Silicone Resin Electrodes : Au Plating Die Heat sink : Ag Plating Copper 4.PACKAGING * The LEDs are packed in cardboard boxes after taping. Please refer to "TAPING DIMENSIONS" and "PACKING" on the following pages. The label on the minimum packing unit shows ; Part Number, Lot Number, Ranking, Quantity * In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation. * The LEDs may be damaged if the boxes are dropped or receive a strong impact against them, so precautions must be taken to prevent any damage. * The boxes are not water resistant and therefore must be kept away from water and moisture. * When the LEDs are transported, we recommend that you use the same packing method as Nichia. 5.LOT NUMBER The first six digits number shows lot number. The lot number is composed of the following characters; - Year ( 7 for 2007, 8 for 2008 ) - Month ( 1 for Jan., 9 for Sep., A for Oct., - Nichia's Product Number - Ranking by Color Coordinates - Ranking by Luminous Flux - Ranking by Forward Voltage B for Nov. ) -2- Nichia STS-DA1-0051 6.RELIABILITY (1) TEST ITEMS AND RESULTS Test Item Resistance to Soldering Heat (Reflow Soldering) Solderability (Reflow Soldering) Thermal Shock Temperature Cycle Moisture Resistance Cyclic High Temperature Storage Temperature Humidity Storage Low Temperature Storage Steady State Operating Life Steady State Operating Life of High Temperature Steady State Operating Life of High Humidity Heat Steady State Operating Life of Low Temperature Permanence of Marking Standard Test Method JEITA ED-4701 300 301 JEITA ED-4701 300 303 JEITA ED-4701 300 307 JEITA ED-4701 100 105 JEITA ED-4701 200 203 JEITA ED-4701 200 201 JEITA ED-4701 100 103 JEITA ED-4701 200 202 Test Conditions Tsld=260C, 10sec. (Pre treatment 30C,70%,168hrs.) Tsld=215 5C, 3sec. (Lead Solder) 0C ~ 100C 15sec. 15sec. -40C ~ 25C ~ 100C ~ 25C 30min. 5min. 30min. 5min. 25C ~ 65C ~ -10C 90%RH 24hrs./1cycle Ta=100C Ta=60C, Ta=-40C Ta=25C, IF=500mA Tested with Nichia standard circuit board. Note 2 times Number of Damaged 0/22 1 time over 95% 20 cycles 100 cycles 10 cycles 1000 hrs. 1000 hrs. 1000 hrs. 1000 hrs. 1000 hrs. 500 hrs. 1000 hrs. 1 time 0/22 0/22 0/22 0/22 0/22 0/22 0/22 0/22 0/22 0/22 0/22 0/22 RH=90% Ta=85C, IF=220mA Tested with Nichia standard circuit board. 60C, RH=90%, IF=350mA Tested with Nichia standard circuit board. Ta=-40C, IF=350mA Tested with Nichia standard circuit board. JEITA ED-4701 500 501 JEITA ED-4701 400 403 JEITA ED-4701 300 304 Vibration Electrostatic Discharges Solvent : Isopropyl Alcohol Solvent Temperature : 20 ~ 25C Dipping Time : 5 min. 100 ~ 2000 ~ 100Hz Sweep 4min. 200m/s2 3directions, 4cycles R=1.5k, C=100pF Test Voltage=2kV 48min. 0/22 3 times Negative/Positive 0/22 Thermal resistance of LED with Nichia standard circuit board : Rja 45C/W Nichia standard circuit board : FR4, t=1.6mm, Copper foil, t=0.07mm (2) CRITERIA FOR JUDGING DAMAGE Criteria for Judgement Min. Max. Item Symbol Test Conditions Forward Voltage VF IF=350mA Initial Level Luminous Flux v IF=350mA Initial Level 0.7 The test is performed after the board is cooled down to the room temperature. -3- 1.1 Nichia STS-DA1-0051 7.CAUTIONS (1) Moisture Proof Package * When moisture is absorbed into the SMT package it may vaporize and expand during soldering. There is a possibility that this can cause exfoliation of the contacts and damage the optical characteristics of the LEDs. For this reason, the moisture proof package is used to keep moisture to a minimum in the package. * The moisture proof package is made of an aluminum moisture proof bag. A package of a moisture absorbent material (silica gel) is inserted into the aluminium moisture proof bag. The silica gel changes its color from blue to pink as it absorbs moisture. (2) Storage * Storage Conditions Before opening the package : The LEDs should be kept at 30C or less and 90%RH or less. The LEDs should be used within a year. When storing the LEDs, moisture proof packaging with absorbent material (silica gel) is recommended. After opening the package : The LEDs should be kept at 30C or less and 70%RH or less. The LEDs should be soldered within 168 hours (7days) after opening the package. If unused LEDs remain, they should be stored in the moisture proof packages, such as sealed containers with packages of moisture absorbent material (silica gel). It is also recommended to return the LEDs to the original moisture proof bag and to reseal the moisture proof bag again. * If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following condition. Baking treatment : more than 24 hours at 65 5C * This product has silver plated metal parts that are inside and/or outside the package body. The silver plating becomes tarnished when being exposed to an environment which contains corrosive gases. Any LED with tarnished leads may lead to poor solderability and deterioration of optical characteristics. Please do not expose the LEDs to corrosive atmosphere during storage. * After assembly and during use, silver plating can be affected by the corrosive gases emitted by components and materials in close proximity of the LEDs within an end product, and the gases entering into the product from the external atmosphere. The above should be taken into consideration when designing. * Please avoid rapid transitions in ambient temperature, especially in high humidity environments where condensation can occur. -4- Nichia STS-DA1-0051 (3) Static Electricity * Static electricity or surge voltage damages the LEDs. It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs. * All devices, equipment and machinery must be properly grounded. It is recommended that precautions be taken against surge voltage to the equipment that mounts the LEDs. * When inspecting the final products in which LEDs were assembled, it is recommended to check whether the assembled LEDs are damaged by static electricity or not. It is easy to find static-damaged LEDs by a light-on test or a VF test at a lower current (below 1mA is recommended). * Damaged LEDs will show some unusual characteristics such as the forward voltage becomes lower, or the LEDs do not light at the low current. Criteria : (VF > 2.0V at IF=0.5mA) (4) Application Design Considerations * In designing a circuit, the current through each LED must not exceed its absolute maximum rating. It is recommended to use Circuit B which regulates the current flowing through each LED. In the meanwhile, when driving LEDs with a constant voltage in Circuit A, the current through the LEDs may vary due to the variation in forward voltage (VF) of the LEDs. In the worst case, some LED may be subjected to stresses in excess of the absolute maximum rating. (A) (B) ... * Thermal design of the end product is of paramount importance. Please consider the heat generation of the LED when making the system design. The coefficient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of LED placement on the board, as well as other components. It is necessary to avoid intense heat generation and operate within the maximum ratings given in this specification. * Please determine the operating current with consideration of the ambient temperature local to the LED and refer to the plot of Ambient temperature vs. Allowable Forward Current on CHARACTERISTICS in this specifications. Please also take measures to remove heat from the area near the LED (heat sink) to improve the operational characteristics of the LED. * The equation 1 indicates correlation between Tj and Ta, and the equation 2 indicates correlation between Tj and Tc. Tj=Ta + Rja W 1 Tj=Tc + Rjc W 2 Tj = Dice Temperature : C, Ta = Ambient Temperature : C, Tc = Die Heat sink Temperature : C, Rja = Heat resistance from Dice to Ambient temperature : C /W, Rjc = Heat resistance from Dice to Tc measuring point 10C /W, W = Inputting Power (IF VF) : W ... -5- Nichia STS-DA1-0051 * Warpage of circuit board with soldered LEDs may result in damage or package breakage of the LEDs. Please pay special attention to the orientation of the LEDs as to avoid LED failure caused by bow, twist and warpage of the board. Non-preferable Cathode mark Preferable Cathode mark Solder connections Solder connections When mechanical stress from the board affects the soldered LED, place the LED in the preferable location and orientation as shown above. * When separating the circuit boards with soldered LEDs, please use appropriate tools and equipment. Hand brake without these tools and equipment may not be used. * The use of aluminum substrate increases stress to solder joints due to thermal expansion of substrate and subsequently may result in solder joint crack. Users may need to evaluate their specific application to determine any impact due to the use of aluminum substrate. -6- Nichia STS-DA1-0051 * Tweezers When handling it with tweezers, the product should only be held by the ceramic body, not by the encapsulant. Failure to comply might result in chip-out and/or delamination of encapsulant, and in the worst cases, catastrophic failure of the LEDs due to wire deformation and/or breakage. Encapsulant Ceramic body * Pick and Place Recommended conditions : Area of outer nozzle 2 mm2 (more than 30% of encapsulant top surface)** Contact area of nozzle with encapsulant 0.9 mm2 (15 to 85% of encapsulant top surface)** Placement pressure 3N/mm2 *max. force : 5N Vacuum pressure 7.8N/ cm2 ( 0.8 kgf/cm2) **For reference. Failure to comply might result in damage to encapsulant and in the worst cases, catastrophic failure of the LEDs due to wire deformation and/or breakage. -7- Nichia STS-DA1-0051 * Printed Circuit Board Assembled (PCB with LEDs soldered) Do not stack assembled PCBs together. Since silicone is a soft material, abrasion between two PCB assembled with silicone encapsulated LED might cause catastrophic failure of the LEDs due to damage to encapsulant (such as scratch, chip-out and delamination) and wire (such as deformation and breakage) and LED detachment. -8- Nichia STS-DA1-0051 Reflow Soldering Lead Solder Pre-heat Pre-heat time Peak temperature Soldering time Condition 10 sec. Max. refer to Temperature - profile 1. 10 sec. Max. refer to Temperature - profile 2. (N2 reflow is recommended.) 120 ~ 150C 120 sec. Max. 240C Max. Lead-free Solder 180 ~ 200C 120 sec. Max. 260C Max. Although the recommended soldering conditions are specified in the above table, reflow soldering at the lowest possible temperature is desirable for the LEDs. A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature. Use the conditions shown to the under figure. [Temperature-profile (Surface of circuit board)] <1 : Lead Solder> 2.5 ~ 5C / sec. Pre-heating 120 ~ 150C 60sec.Max. Above 200C <2 : Lead-free Solder> 240C Max. 10sec. Max. 1 ~ 5C / sec. 1 ~ 5C / sec. Pre-heating 180 ~ 200C 60sec.Max. Above 220C 260C Max. 10sec. Max. 2.5 ~ 5C / sec. 120sec.Max. 120sec.Max. [Recommended soldering pad design] 4.0 2.8 Use the following conditions shown in the figure. 2.9 1.8 (Unit : mm) 1.8 4-R0.3 * Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere during air reflow. It is recommended that the User use the nitrogen reflow method. * Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a hot plate should be used. It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. * Reflow soldering should not be done more than two times. * Die Heat sink is to be soldered. If not, please use the heat conductive adhesive. * When soldering, do not put stress on the LEDs during heating. * After soldering, do not warp the circuit board. -9- Nichia STS-DA1-0051 -10- Nichia STS-DA1-0051 ICI Chromaticity Diagram 0.9 520 530 0.8 510 0.7 540 G H 550 560 0.6 570 500 0.5 580 590 y 0.4 600 610 620 630 0.3 490 0.2 480 0.1 470 460 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 x Color Coordinates Measurement allowance is 0.01 -11- Forward Voltage vs. Forward Current Ta=25C Relative Luminous Flux (a.u.) Forward Current IFP (mA) 1000 800 350 Forward Current vs. Relative Luminous Flux 2.5 Ta=25C 2.0 1.5 1.0 0.5 0 0 200 400 600 800 1000 Forward Current IFP (mA) Allowable Forward Current IFP (mA) Duty Ratio vs. Allowable Forward Current 1000 800 500 Ta=25C 100 50 200 10 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Forward Voltage VF (V) 100 1 5 10 20 50 100 Duty Ratio (%) Ambient Temperature vs. Forward Voltage Relative Luminous Flux (a.u.) 5.5 Forward Voltage VF (V) 5.0 4.5 4.0 3.5 3.0 2.5 -60 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta (C) IFP=350mA Ambient Temperature vs. Relative Luminous Flux 2.0 IFP=350mA 1.0 Allowable Forward Current IF (mA) Ambient Temperature vs. Allowable Forward Current 600 500 400 300 227 100 0 0 20 40 60 80 100 Ambient Temperature Ta (C) Thermal resistance Rja=45C/W -12- 0.5 0.2 -60 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta (C) Nichia STS-DA1-0051 Model NJSG107 NICHIA CORPORATION Title No. CHARACTERISTICS 071106703551 Forward Current vs. Chromaticity Coordinate (D) Relative Emission Intensity (a.u.) Spectrum 1.2 1.0 0.8 0.6 0.4 0.2 0 400 500 600 Wavelength (nm) 700 Ta=25C IFP=350mA 0.85 Ta=25C 0.80 0.75 350mA 100mA (530nm) (535nm) 500mA 20mA(540nm) (528nm) 800mA(526nm) y 0.70 0.65 0.60 0.10 0.15 0.20 0.25 0.30 0.35 x Forward Current vs. Dominant Wavelength Dominant Wavelength D (nm) Dominant Wavelength D (nm) Ambient Temperature vs. Dominant Wavelength 545 540 535 530 525 520 515 -60 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta (C) IFP=350mA Relative Illuminance (a.u.) Directivity 1.0 0 10 20 30 40 50 0.5 Ta=25C IFP=350mA 0 90 60 30 Radiation Angle 0 0.5 60 70 80 90 1.0 545 540 535 530 525 520 515 10 100 1000 Forward Current IFP (mA) Ta=25C -13- Nichia STS-DA1-0051 Model NJSG107 NICHIA CORPORATION Title No. CHARACTERISTICS 071106703561 Cathode mark 3.5 2.8 1.5 0.8 2 Die Heat sink Cathode 4-R4 Anode 2.9 0.1 3.3 0.1 A K Protection device ITEM PACKAGE ENCAPSULATING RESIN ELECTRODES DIE HEAT SINK MATERIALS Ceramics Silicone Resin Au Plating Ag Plating Copper 2.8 0.1 3.5 2.8 2 -14- Nichia STS-DA1-0051 Note 1) NJSG107 has a protection device built in as a protection circuit against static electricity. Note 2) The die heat sink is electrically neutral. Model NJSG107 Unit mm 8/1 Scale Allow 0.2 NICHIA CORPORATION Title No. OUTLINE DIMENSIONS 071106703571 Taping part 1.5+0.1 -0 80.1 20.05 40.1 1.750.1 0.20.05 3.850.1 Reel part 180+0 -3 15.41 13+1 -0 5.50.05 Cathode mark 12+0.3 - 0.1 2 1 0.8 13 0.2 1.5+0.2 -0 3.850.1 20.1 Label XXXX LED LEDs mounting part TYPE NJSx107T LOT xxxxxxQTY pcs RoHS Reel End of tape No LEDs No LEDs 60+1 -0 Pull direction Top cover tape Embossed carrier tape -15Reel Lead Min.160mm (No LEDs) Reel Lead Min.100mm (No LEDs) Reel Lead Min.400mm 1,200pcs/Reel Taping is based on the JIS C 0806 : Packaging of Electronic Components on Continuous Tapes. Model NJSx107T Unit mm Scale Allow Nichia STS-DA1-0051 NICHIA CORPORATION Title No. TAPING DIMENSIONS 070711767921 Nichia STS-DA1-0051 The reel and moisture absorbent material are put in the moisture proof foil bag and then heat sealed. Reel Label Seal TYPE LOT QTY NICHIA XXXX LED NJSx107T xxxxxxPCS NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN RoHS Moisture absorbent material Moisture proof foil bag The box is partitioned with the cardboard. Label NICHIA Nichia LED XXXX LED TYPE RANK QTY NJSx107T PCS NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN RoHS Packing unit Moisture proof foil bag Cardboard box Cardboard box S Cardboard box M Cardboard box L Reel/bag 1reel Quantity/bag (pcs) 1,200 MAX. Reel/box 5reel MAX. 10reel MAX. 20reel MAX. Quantity/box (pcs) 6,000 MAX. 12,000 MAX. 24,000 MAX. Dimensions (mm) 291 237 120 8t 259 247 243 5t 444 262 259 8t Model NJSx107T NICHIA CORPORATION Title No. PACKING 070628767931 -16- |
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